Samsung Elec and AMD sign MoU on AI memory, explore foundry partnership
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Samsung Electronics and Advanced Micro Devices (AMD) signed a memorandum of understanding to expand their strategic partnership on memory chip supplies for artificial intelligence infrastructure, the companies said on Wednesday. The agreement will focus on supplying Samsung's next-generation high-bandwidth memory (HBM4) for AMD's upcoming Instinct MI455X AI accelerators, as well as optimised DDR5 memory for AMD's sixth-generation EPYC processors, they said in a statement. The companies will also discuss opportunities for a foundry partnership, under which Samsung could provide contract chip manufacturing services for next-generation AMD products.
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Samsung Electronics and Advanced Micro Devices (AMD) signed a memorandum of understanding to expand their strategic partnership on memory chip supplies for artificial intelligence infrastructure, the companies said on Wednesday. The agreement will focus on supplying Samsung's next-generation high-bandwidth memory (HBM4) for AMD's upcoming Instinct MI455X AI accelerators, as well as optimised DDR5 memory for AMD's sixth-generation EPYC processors, they said in a statement. The companies will also discuss opportunities for a foundry partnership, under which Samsung could provide contract chip manufacturing services for next-generation AMD products.